Innovation and Technology Support Programme (ITSP) - Seed

Objectives:

• Support applied R&D projects undertaken by R&D Centres or designated local public research institutes.
• Facilitate technology transfer and commercialization potential.
• Seed projects are exploratory and forward-looking, laying foundations for future applied R&D.

Target Beneficiaries:

• Lead applicants must be R&D Centres or designated local public research institutes.
• Industry sponsorship is not mandatory for seed projects.
• Collaborative projects require industry partners, but seed projects do not.

Key Features:

• Seed projects have a maximum funding support of HK$2.8 million for R&D Centres and HK$1.4 million for other applicants.
• Maximum project duration is 18 months.
• Intellectual Property (IP) rights ownership belongs to the lead applicant.
• Seed projects are exploratory, aiming to develop new ideas and technologies.
• Industry sponsorship is required for platform projects but not for seed projects.
• Majority of R&D work should be conducted in Hong Kong; up to 50% can be done in Mainland China with justification.

Application Process:

• ITSP (Platform & Seed) calls for applications once a year; 2024/25 application period is from 25 November 2024 to 28 February 2025.
• Applications from R&D Centres are accepted year-round.
• Applicants must follow detailed guides and submit through the Innovation and Technology Commission Funding Administrative System.
• Applications undergo preliminary screening and may be externally reviewed.
• Assessment is conducted by the ITF Research Projects Assessment Panel.

Additional Notes:

• Industry sponsors may receive benefits like early access to results or licensing discounts but do not own IP rights.
• Seed projects focus on exploratory R&D without mandatory industry sponsorship, supporting innovation at early stages.

Contact and further details are available on the official ITF website.